Space Avionics

OVERVIEW

Our class 100K avionic lab houses a skilled manufacturing team backed by experienced designers. We utilize board layout design software and a wide range of equipment.

our equipment

Automated Stencil Printer

Wave Solder Machine

Electrovert OmniFlo
10-Hot Gas 
Reflow Oven

Mycronics Automated Pick and Place

Aqueous Cleaner

Conformal Coat Equipment

Rehm Thermal System

 

CondensoXS Vacuum

Condensation Soldering System

Circuit Card Assembly(CCA) Lamination

Class Zero Workstations

Lead Forming and Tinning

Forced Hot Gas Rework Station

NIST Calibration Requirement

Genesis is licensed to produce and market the NASA GSFC SpaceCube 2.0 design, GEN6000, which utilizes reconfigurable processor technology.

Our end-to-end Space Avionics capabilities include 
the following demonstrated circuit card processes which meet all NASA requirements:

Surface Mount Technology

— Leadless Chip Carriers

— Ball Grid Array (1760)

— Column Grid Array (1760)

— Chip Capacitors/ Resistors

— TSOP & Flatpack

— Lamination Process

    2 PWBs Mounted to Heatsink

— Hypertronics cPCI Connectors

Avionic and Electrical Certifications

IPC J-STD-001– Space Addendum to IPC J-STD-001 Requirements for Soldered Electrical and Electronic Connections

NASA-STD-8739.3 – Soldered Electrical Connections

NASA-STD-8739.4 – Crimping, Interconnecting Cables, Harnesses and Wiring

 

NASA-STD-8739.1 Polymeric Application and Inspection

NASA-STD 8739.1 Mate/Demate connector training

300-PG-8730.6.1 ESD Control Plan

Cleanroom

Confined Space