Overview
Our class 100K avionics lab houses a skilled manufacturing team backed by experienced designers. We utilize board layout design software and a wide range of equipment.
Our Equipment
- Automated Stencil Printer
- Wave Solder Machine
- Electrovert OmniFlo
10-Hot Gas Reflow Oven - Mycronics Automated Pick and Place
- Aqueous Cleaner
- Conformal Coat Equipment
- Rehm Thermal System
- CondensoXS Vacuum
- Condensation Soldering System
- Circuit Card Assembly(CCA) Lamination
- Class Zero Workstations
- Lead Forming and Tinning
- Forced Hot Gas Rework Station
- NIST Calibration Requirement
Genesis is licensed to produce and market the NASA GSFC SpaceCube 2.0 design, GEN6000, which utilizes reconfigurable processor technology.
Our end-to-end Space Avionics capabilities include the following demonstrated circuit card processes which meet all NASA requirements:
Surface Mount Technology
- Leadless Chip Carriers
- Ball Grid Array (1760)
- Column Grid Array (1760)
- Chip Capacitors/ Resistors
- TSOP & Flatpack
- Lamination Process
- 2 PWBs Mounted to Heatsink
- Hypertronics cPCI Connectors
Avionic and Electrical Certifications
- IPC J-STD-001– Space Addendum to IPC J-STD-001 Requirements for Soldered Electrical and Electronic Connections
- NASA-STD-8739.3 – Soldered Electrical Connections
- NASA-STD-8739.4 – Crimping, Interconnecting Cables, Harnesses and Wiring
- NASA-STD-8739.1 Polymeric Application and Inspection
- NASA-STD 8739.1 Mate/Demate connector training
- 300-PG-8730.6.1 ESD Control Plan
- Cleanroom
- Confined Space